Dell | EMC

Basic Architecture

Dell | EMC storage solutions use a modular design that greatly increases both scalability and availability. Common Dell | EMC storage enclosures are modified to perform specific tasks within the system. This modular design provides a high degree of flexibility in installation as enclosures used to form a unit may either be housed together in a rack or housed in multiple racks.

• Disk Processor Enclosures (DPEs): The foundation of all Dell | EMC storage systems, a storage solution MUST have at least one Disk Processor Enclosure to function. DPEs control the storage solution as well as provide baseline storage. Multiple DPEs are used in some applications to increase availability and redundancy.

• Disk Array Enclosures (DAEs): DAEs provide additional storage capacity for the unit. They must be used in conjunction with a DPE, however multiple DAEs may be supported by a single DPE. DAEs are designed to be easily added to a Dell | EMC system, providing additional storage as needs grow.

DPE Components

• Storage Processors (SPs):

  

  Storage processors are analogous to the system board in a server. They provide the "brains" of the storage solution, allowing it to control the data requests the system receives. Every DPE contains two storage processors to provide redundancy and increased availability. SPs may be hot-swapped if necessary, and they are easily removed from the enclosure:



• Hard drives: All DPEs contain 10 Fibre Channel hard drives that provide baseline storage for the storage unit.

• Fan Packs: Redundant, hot-swappable fan packs cool the components in the DPE.

• Power Supplies: Dual redundant power supplies are hot-swappable to assure uninterrupted power to the DPE, and may be connected to separate power sources for added security.

• LCC: DPEs contain dual Link Control Cards, which can connect the DPE to a DAE. Additionally, they provide port bypass circuitry for failed drives and monitor the DPE's environmental conditions.

DAE Components

• Link Control Cards (LCCs): LCCs connect the DAE to either a DPE or another DAE using the Fibre Channel interface.

• Hard drives: DAEs may contain up to 10 Fibre Channel hard drives for storage. Unlike DPEs, DAEs may be purchased without all drive slots filled.

• Fan Packs: Redundant, hot-swappable fan packs are used to cool the DPE components.

• Power Supplies: Dual redundant power supplies are hot-swappable to assure uninterrupted power to the DPE, and may be connected to separate power sources for added security.